From the research of lead-free solders for many years, most of the research is to seek high-performance and high-quality materials by changing the content. However, these solders have not good properties except low melting point, sometimes even can not be used. At the same time, it is necessary to improve the manufacturing equipment and re-explore the surface treatment of the connecting substrates. In addition, in the production of reflow welding and flow welding hybrid installation of substrates, measures must be taken to alleviate the stress caused by thermal expansion and warping of substrates, resulting in welded joints. Otherwise, the reliability of the connection will not be guaranteed and will cause trouble.

In addition, the solder used for flow welding and impregnation welding in commonly used solder tanks can be used if it can be operated at the current welding temperature, even for alloys with higher melting points such as tin, copper, tin and silver, as long as the fluidity can be guaranteed. In fact, it is very important to analyze the change of properties according to the reliability and composition change of solder and impurity mixing. Of course, it will take some time to explore these contents.

In addition, the evaluation of patents and costs is also indispensable. No matter which one is missing, it can not be used as a reassuring permanent material. As a result, large users are cautious in determining the composition, but time varies. The process of reassessing lead-free solders from alloy composition is not consistent with the deadline for lead-containing solders to be used. As a result, only a small number of solders of practical value have been used.

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